國立成功大學工程科學系

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莊婉君 助理教授
介紹
莊婉君照片
姓名:
莊婉君
職稱:
助理教授
學歷:
國立台灣大學應用力學所博士
分機:
63324
信箱:
z11302002@ncku.edu.tw
成就:
個人學術成就
實驗室:
微系統設計與分析實驗室
專長:
多重物理領域耦合系統分析, 晶圓級薄膜機械性質檢測技術, 微奈米系統, 半導體與先進封裝製程技術
經歷
起迄時間
名稱
2010-08~2011-07
國立台灣大學應用力學研究所 專任助教
2011-10~2012-05
友達光電股份有限公司Flexible技術部 高級工程師
2012-08~2020-01
國立中山大學機械與機電工程學系 助理教授
2016-08~2018-07
高雄醫學大學運動醫學系 合聘助理教授
2020-02~2024-01
國立中山大學機械與機電工程學系 副教授
2024-02~迄今
國立成功大學工程科學系 助理教授
期刊論文
  1. W. C. Chuang*, Y. Huang, and P.-E. Chen, "Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging," Materials, vol. 16, no. 9, 2023.
  2. W. C. Chuang* and W. L. Chen, "Study on the Strip Warpage Issues Encountered in the Flip-chip Process," Materials, vol. 15(1), 323, 2022.
  3. W. C. Chuang* and W. L. Chen, "Investigation of strip warpage behavior in wire bonding process," Journal of Electronic Packaging, vol. 142, pp. 021002-021014, 2020.
  4. W. C. Chuang* and W. L. Chen, "Fatigue prediction for molded wafer level package during temperature cycling," Journal of Electronic Packaging, vol. 142, pp. 011007-011014, 2020.
  5. W. C. Chuang* and W. L. Chen, "Real-time monitoring for knee extensor muscle training with flexible sensors," IEEE/ASME Journal of microelectromechanical systems, vol. 28, pp. 1005-1012, 2019.
  6. W. C. Chuang* and W. L. Chen, "Using Taguchi method to identify the key factors of increasing spacing between the dies during dicing tape expansion," Journal of the Chinese Institute of Engineers, vol. 42, pp. 290-296, 2019.
  7. W. C. Chuang*, "The robustness of an algorithm applied in wafer‑level material property extraction," Microsystem Technologies, vol. 22, pp. 531-536, 2016.
  8. W. C. Chuang*, H. T. Lin, and W. L. Chen, "Strengthening of back muscles using a module of flexible strain sensors," Sensors, vol. 15, pp. 3975-87, 2015.
  9. W. C. Chuang, David T. W. Lin*, Y. C. Hu, H. L. Lee, C. H. Cheng, P. Z. Chang, and N. B. Quyen, "A method integrating optimal algorithm and FEM on CMOS residual stress," Journal of Mechanics, vol. 30, pp. 123-128, 2014.
  10. W. C. Chuang*, Y. C. Hu, and P. Z. Chang, "CMOS-MEMS test-key for extracting wafer-level mechanical properties, " Sensors, vol. 12, pp. 17094-17111, 2012.
  11. W. C. Chuang, C. W. Wang, W. C. Chu, P. Z. Chang, and Y. C. Hu, "The fringe capacitance formula of microstructures," Journal of Micromechanics and Microengineering, vol. 22, pp. 25015-25021, 2012.
  12. W. C. Chuang, H. L. Lee, P. Z. Chang, and Y. C. Hu, "Review on the modeling of electrostatic MEMS," Sensors, vol. 10, pp. 6149-6171, 2010.
  13. W. C. Chuang, Y. C. Hu, C. Y. Lee, W. P. Shih, and P. Z. Chang, "Electromechanical behavior of the curled cantilever beam," Journal of Micro-Nanolithography Mems and Moems, vol. 8, pp. 033020-1 - 033020-8, 2009.
  14. Y. C. Hu, P. Z. Chang, and W. C. Chuang, "An approximate analytical solution to the pull-in voltage of a micro bridge with an elastic boundary," Journal of Micromechanics and Microengineering, vol. 17, pp. 1870-1876, 2007.
研討會論文
  1. 莊婉君*、王中叡，覆晶封裝薄殼結構翹曲模擬模型，中國機械工程學會112年度年會暨第40屆全國學術研討會，彰化，台灣，十二月，2023
  2. 莊婉君*、陳伯恩，不同載台種類對扇出型封裝模化成型製程之晶圓翹曲量影響，2023 中華民國力學學會年會暨第 47 屆全國力學會議，雲林，台灣，十一月
  3. 莊婉君*、陳伯恩，應用人工智能軟體探討模封材料性質變異性對於封裝體翹曲之影響，第一屆台灣計算力學學會年會與第十四屆台灣邊界元素法會議暨學術研討會，基隆，台灣，十月，2023
  4. W. C. Chuang*, P. E. Chen, "The effect of different die size on wafer warpage during decarrier process in fan-out wafer-level packaging." International Conference on Mechatronic, Automobile, and Environment Engineering, Bangkok, Thailand, August 3-5, 2023
  5. W. C. Chuang*, K. L. Hsiao, "Development of a real time motion detection system for assistive seated rowing exercise training." Annual Conference on Engineering and Information Technology, Osaka, Japan, July 12-14, 2023
  6. 莊婉君*、賴彥澄、趙偉祥，不同運動族群之捲腹運動動作分析，台灣機電工程國際學會第八屆全國學術研討會(ISME2023) ，高雄，台灣，四月，2023
  7. 莊婉君*、黃翌、李仁傑，移除載台製程之製程時間對晶圓級扇出型封裝的翹曲影響，台灣機電工程國際學會第八屆全國學術研討會(ISME2023) ，高雄，台灣，四月，2023
  8. 莊婉君*、黃翌，移除載台步驟之製程溫度對晶圓級扇出型封裝的翹曲量影響，台灣機電工程國際學會第八屆全國學術研討會(ISME2023) ，高雄，台灣，四月，2023
  9. 莊婉君*、陳伯恩，模製化合物之玻璃轉換溫度對扇出型封裝移除載台步驟之晶圓翹曲量影響，台灣機電工程國際學會第八屆全國學術研討會(ISME2023) ，高雄，台灣，四月，2023
  10. 莊婉君*、陳伯恩，模製化合物材料特性於楊氏係數對應溫度變化區間對晶圓翹曲量影響，台灣機電工程國際學會第八屆全國學術研討會(ISME2023) ，高雄，台灣，四月，2023
  11. 莊婉君*、王中叡，覆晶封裝薄殼結構模型網格分割技術探討，台灣機電工程國際學會第八屆全國學術研討會(ISME2023) ，高雄，台灣，四月，2023
  12. 莊婉君*、黃翌，模制化合物對扇出型封裝翹曲量影響分析，中國機械工程學會第三十九屆全國學術研討會(CSME39) ，苗栗，台灣，十二月，2022
  13. W. C. Chuang*, Y. Huang, C. Y. Wang, Q. H. Lin, F. S. Chen, Z. W. Chang, P. S. Hsieh, "A model for evaluating warpage of fan-out package during the carrier removal process." International Conference on Mechatronic, Automobile, and Environment Engineering, Penghu, Taiwan, July 15-17, 2022
  14. 莊婉君*、蕭冠倫、賴彥澄、趙偉祥，可撓感測器與接線端子電阻訊號分析，台灣機電工程國際學會第七屆全國學術研討會(ISME2022) ，彰化，台灣，四月，2022
  15. 莊婉君*、賴彥澄、蕭冠倫、趙偉祥，應用於可撓性感測器黏貼之單雙層導電膠帶比較，台灣機電工程國際學會第七屆全國學術研討會(ISME2022) ，彰化，台灣，四月，2022
  16. 莊婉君*、賴彥澄、蕭冠倫、趙偉祥，應用於可撓性感測器黏貼之感測器長度量測比較，台灣機電工程國際學會第七屆全國學術研討會(ISME2022) ，彰化，台灣，四月，2022
  17. 莊婉君*、黃子安 、黃翌 、李仁傑，不同模製化合物在覆晶封裝模製成型製程下翹曲量分析，台灣機電工程國際學會第七屆全國學術研討會(ISME2022) ，彰化，台灣，四月，2022
  18. 莊婉君*、黃翌 、李仁傑，不同模製化合物在覆晶封裝的封膠製程下之應力分析，台灣機電工程國際學會第七屆全國學術研討會(ISME2022) ，彰化，台灣，四月，2022
  19. 莊婉君*、黃翌 、李仁傑，覆晶封裝體在封膠製程中不同模製化合物的應變分析，台灣機電工程國際學會第七屆全國學術研討會(ISME2022) ，彰化，台灣，四月，2022
  20. W. C. Chuang*, K. L. Hsiao, Y. C. Lai, J. C. Li, W. H. Chao, "Motion detection and analysis of 90-degree wrist flexion training," International Conference on Mechatronic, Automobile, and Environment Engineering, Hualien, Taiwan, October 22-24, 2021
  21. 莊婉君*、 賴彥澄 、 蕭冠倫 、 李仁傑 、 趙偉祥 ，腳踏車卷腹訓練動作之偵測與發電系統，第十六屆全國氫能與燃料電池學術研討會暨第八屆台灣能源學會年會(HEFC2021)，台南，台灣，九月，2021
  22. 莊婉君*、蕭冠倫、趙偉祥，手腕屈曲六十度訓練動作偵測與分析 ，台灣機電工程國際學會第六屆全國學術研討會(ISME2021) ，桃園，台灣，五月，2021
  23. 莊婉君*、蕭冠倫、趙偉祥，手腕運動之手部表皮應變探討與分析 ，台灣機電工程國際學會第六屆全國學術研討會(ISME2021)，桃園，台灣，五月，2021
  24. 莊婉君*、賴彥澄、趙偉祥，捲腹運動動作分析與討論，台灣機電工程國際學會第六屆全國學術研討會(ISME2021)，桃園，台灣，五月，2021
  25. 莊婉君*、賴彥澄、趙偉祥，仰臥起坐運動動作分析與討論，台灣機電工程國際學會第六屆全國學術研討會(ISME2021)，桃園，台灣，五月，2021
  26. W. C. Chuang*, Y. C. Chang and Y. C. Lai, "Development of the system for determining the mechanical properties of thin film," International Conference on Mechatronic, Automobile, and Environment Engineering, Kinmen, Taiwan, November 6-8th, 2020
  27. W. C. Chuang*, K. L. Hsiao, W. H. Chao and W. L. Chen, "Development of a real-time motion detection system," International Conference on Mechatronic, Automobile, and Environment Engineering, Kinmen, Taiwan, November 6-8th, 2020
  28. W. C. Chuang*, Y. C. Chan and P. H. Tseng, "Microstructure pull-in voltage extraction system," International Conference on Mechatronic, Automobile, and Environment Engineering, Kinmen , Taiwan, November 6-8th, 2020
  29. 莊婉君*、趙偉祥、陳威龍，手腕運動動作角度偵測系統，中華民國力學學會第四十四屆全國力學會議 (CTAM 2020)，宜蘭，台灣，十一月，2020
  30. 莊婉君*、趙偉祥、張壹筌，微結構吸附電壓萃取系統，中華民國力學學會第四十四屆全國力學會議 (CTAM 2020)，宜蘭，台灣，十一月，2020
  31. 莊婉君*、趙偉祥、陳威龍，隱形雷射後晶圓擴片之模型建立與探討，台灣機電工程國際學會第五屆全國學術研討會(ISME2020)，台中，台灣，八月，2020
  32. 莊婉君*、趙偉祥、張壹筌，萃取薄膜材料之蒲松比系統開發，台灣機電工程國際學會第五屆全國學術研討會(ISME2020)，台中，台灣，八月，2020
  33. W. C. Chuang*, W. L. Chen, "Important factors on the spacing between the dies after sd dicing tape expansion," 22nd International Conference on Materials, Methods and Technologies , Burgas, Bulgaria, June, 22-26th, 2020
  34. W. C. Chuang*, W. L. Chen , C. F. Wang , "Flexible sensor module applied in sit up training exercises," 9th International Conference on Nanotechnology and Materials Science, Osaka, Japan, October, 14-16th, 2019
  35. W. C. Chuang*, W. L. Chen, "Simulation model for single unit warpage of shadow moire in flip-chip process," Conference of Computational Methods in Multi-scale, Multi-uncertainty and Multi-physics Problems, Porto, Portugal, July 15-17th, 2019
  36. 莊婉君*、趙偉祥、陳威龍，潛艦匿聲推進技術評估及市場分析報告，台灣機電工程國際學會第四屆全國學術研討會(ISME2019)，高雄，台灣，二月，2019
  37. W. C. Chuang* and Y. C. Chang, " Empirical formula for estimating frequency of resonator with etched holes," 7th Nanotechnology and Material science, Frankfurt, Germany, November, 5-7th, 2018
  38. W. C. Chuang* and K. Chen, "Analysis of the thermal deformation behavior for a fixed-fixed beam structure," International Conference on Mechatronic, Automobile, and Environment Engineering (ICMAEE), Chiang Mai , Thailand, July 7-9th, 2018
  39. W. C. Chuang* and W. L. Chen, "Simulation model for strip warpage of molding process, " 5th Annual Conference on Engineering and Information Technology (ACEAIT), Kyoto, Japan, March 27-29th, 2018
  40. 莊婉君*、陳楷，微型橋結構之熱變形分析與量測，台灣機電工程國際學會第一屆第三次年會暨全國學術研討會(ISME2018)，台南，台灣，二月，2018
  41. W. C. Chuang* and W. L. Chen, "Development of fabrication for flexible sensor applied to knee flexion and extension training," 33th Sensors and Actuators, Stockholm, Sweden, October 8-11th, 2017
  42. W. C. Chuang*, W. L. Chen, B. Tsai, and J. Su, "Reliability of ball grid array subjected to temperature cycling," Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP’2017), Bordeaux , France, May, 29th - June, 1st, 2017
  43. W. C. Chuang* and K. Chen, "Design of micro torsion-mirror and its electromechanical behavior," International Conference on Mechatronic, Automobile, and Environment Engineering, Yantai, China, May 27th - 29th 2017
  44. W. C. Chuang* and K. Chen, "The key factor of pull-in voltage of micro torsion-mirror structure," International Conference on Mechatronic, Automobile, and Environment Engineering, Yantai, China, May 27th - 29th 2017
  45. W. C. Chuang* and K. Chen, "Empirical formula about pull-in voltage of micro torsion-mirror, " International Conference on Mechatronic, Automobile, and Environment Engineering, Yantai, China, May 27th - 29th 2017
  46. W. C. Chuang* and C. H. Kuo, ""Analysis for electro-mechanical behavior of a fixed-fixed beam with thermal deformation and undercut effect," Asian Conference on Engineering and Natural Sciences, Hokkaido, Japan, January 19th - 21st 2017
  47. W. C. Chuang* and B. Y. Huang, "A real-time monitoring system for Knee Muscles Training," International Conference on Mechanical, Industrial and Power Engineering, Tokyo, Japan, December 6th - 8th 2016
  48. W. C. Chuang*, " Analysis for the variation of resonant frequency of a micro clamped-clamped resonator with etching holes," International Conference on Design and Manufacturing Engineering (ICDME2016), Auckland, New Zealand, November 19-21, 2016
  49. W. C. Chuang* and W. L. Chen, Ben Tsai, Josh Su, "Analysis of wafer level chip scale package subjected to uniform pressure," 2nd International Conference on Computing and Precision Engineering, Kenting, Taiwan, Sep. 30th - Oct. 3th 2016
  50. W. C. Chuang* and J. Y. Lin, "Empirical formula for pull-in voltage of fixed–fixed beam with elastic deformation," 1st International Conference on Engineering and Science, Yilan, Taiwan, July 8-10th 2016
  51. W. C. Chuang*, W. L. Chen, B. Tsai, and R. Wu, " The trends of change of die gap control effect during the process of dicing wafer expanding," Design, Test, Integration& Packaging of MEMS/MOEMS (DTIP’2016), Budapest , Hungary, May, 30th - June, 2nd, 2016
  52. 莊婉君*、黃任廷，具蝕刻孔之微結構電彈性分析及其於可調變共振器之應用研究，中國機械工程學會第三十二屆全國學術研討會(CSME32)，高雄，台灣，十二月，2015
  53. W. C. Chuang* and J. Y. Lin, " Analysis for pull-in voltage variations of fixed–fixed beam with elastic deformation in current input," World Congress on Advances in Structural Engineering and Mechanics(ASEM 2015), Incheon, Korea, Aug. 25-29, 2015
  54. W. C. Chuang*, W. H. Tu, G. S. Lin, J. Y. Hwang, and C. S. Lee, "Fracture mechanism analysis for stealth dicing applied in wafer expansion," Design, Test, Integration& Packaging of MEMS/MOEMS (DTIP'2015), Montpellier, France, April 27-30, 2015
  55. 莊婉君*、戴聿，靜電式驅動之微鏡片扭轉行為研究，中國機械工程學會第三十一屆全國學術研討會(CSME31)，台中，台灣，十二月，2014
  56. W. C. Chuang* , J.Y. Lin, and J.C. Li, “Analysis of pull-in voltage variations in fixed–fixed beams with elastic deformation,” 2nd International Conference of Multi Disciplines of Engineering on Advanced Technology and Environmentalism Design (MDEATED 2014), Tainan, Taiwan, Oct. 31- Nov. 2, 2014
  57. W. C. Chuang*, W. L. Chen, and H. T. Lin, “Optimized design of flexible strain sensor for stimulation of spinal muscles,” 2nd International Conference of Multi Disciplines of Engineering on Advanced Technology and Environmentalism Design (MDEATED 2014), Tainan, Taiwan, Oct. 31- Nov. 2, 2014
  58. W. C. Chuang*, and Y. Dai, “Study on the electro-mechanical behavior of the micro torsion-mirror ,” 2nd International Conference of Multi Disciplines of Engineering on Advanced Technology and Environmentalism Design (MDEATED 2014), Tainan, Taiwan, Oct. 31- Nov. 2, 2014
  59. W. C. Chuang* , W. L. Chen , H. T. Lin, “Flexible strain sensor module applied on the activation of spinal muscle,” 1st International Electronic Conference on Sensors and Application, June 01-16, 2014
  60. W. C. Chuang, and Y. R. Lin, " The robustness of an algorithm applied in wafer-level material property extraction," Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP2014), Cannes, France, April 02-04, 2014
  61. 莊婉君*、林育如，晶圓級薄膜材料性質演算法之穩健性探討，中國機械工程學會第三十屆全國學術研討會(CSME30)，宜蘭，台灣，十二月，2013
  62. 莊婉君*、陳威龍，應用於脊椎肌肉活化訓練之可撓感測器開發，中國機械工程學會第三十屆全國學術研討會(CSME30)，宜蘭，台灣，十二月，2013
  63. 莊婉君*、胡毓忠、林大偉、吳保權、張培仁、李新立、王欽宏，CMOS製程相容之樑結構應力模擬分析技術，中國機械工程學會第二十九屆全國學術研討會(CSME29)，高雄，台灣，十二月，2012
  64. W. C. Chu, W. C. Chuang, W. H. Tu, P. Z. Chang, and Y. C. Hu, "Etching holes effects for CMOS-MEMS capacitive structure," 22nd International Conference on Adaptive Structures and Technologies , paper no:078 ,Corfu –Greece, October 10-12, 2011
  65. W. C. Chuang, Y. C. Hu, C. W. Wang et al., “A Fringing Capacitance Model for Electrostatic Microstructure,” 13th International Congress on Mesomechanics, Vicenza, Italy, 2011
  66. W. C. Chuang, H. L. Lee, T. W. Lin, Y. C. Hu, P. Z. Chang, N. B. Ouyen, “Optimal residual stress in CMOS fabrication,” 34th National Conference on Theoretical and Applied Mechanics, Yunlin, Taiwan, Nov. 19-20, 2010
  67. W. C. Chuang, H. L. Lee, Y. C. Hu et al., “Electromechanical coupling of CMOS-MEMS testkey for extracting material properties,” 1st IFToMM Asian Conference on Mechanism and Machine Science, Taipei, Taiwan, 2010
  68. W. C. Chuang, C. W. Lin, Y. C. Hu et al., “An analytical model for optimizing LCD-cell design,” 12th International Congress on Mesomechanics, Taipei, Taiwan, 2010
國科會計畫
  1. 整合光機電技術之晶圓級材料性質檢測系統研發 (Ⅰ) (NSC 101-2218-E-110 -006)2012 - 2013
  2. 整合光機電技術之晶圓級材料性質檢測系統研發 (Ⅱ) (NSC 102-2221-E-110 -052)2013 - 2014
  3. 具蝕刻孔之微結構電彈性分析及其於可調變共振器之應用研究 (MOST 103-2221-E-110 -032)2014 - 2015
  4. 微鏡面結構電彈性分析與最佳化探討 (MOST 104-2221-E-110-011)2015 - 2016
  5. 萃取薄膜材料熱膨脹係數之標準測試件開發與最佳化分析 (MOST 105-2221-E-110 -036 -MY2)2016 - 2018
  6. 輔助運動訓練之動作即時偵測系統開發 (MOST 107-2221-E-110-070-MY3)2018 - 2021
  7. 薄型覆晶封裝體失效模式分析與最佳化設計探討 (MOST 110-2221-E-110-035)2021 - 2022
  8. 薄型覆晶封裝體失效模式分析與最佳化設計探討(Ⅱ) (MOST 111-2221-E-110-049)2022 - 2023
產學計畫
  1. 永華光電有限公司-雷射切割表面檢測 (N102038)2013 - 2014
  2. 日月光半導體製造股份有限公司- 隱形雷射技術應用於晶圓分割之破裂機制分析 (N102114)2013 - 2014
  3. 日月光半導體製造股份有限公司-「Dicing wafer expand rule for die to die gap control effect corner chipping」(N103146)2014 - 2015
  4. 日月光半導體製造股份有限公司-「Simulation and Analysis for WLCSP Protection Thickness / Material Type for Package Structure」(N104169)2015 - 2016
  5. 日月光半導體製造股份有限公司-「Simulation Study on Dynamic Warpage Behavior with Different Substrate Thickness and Temperature Profile」(N105165)2016 - 2017
  6. 日月光半導體製造股份有限公司- 「Thin Wire Bond DRAM product for strip / package warpage influence factor simulation analysis」 (N106177)2017 - 2018
  7. 日月光半導體製造股份有限公司- 「擴片對應多重晶粒組合與厚度的探討與模擬模型的建立」(N107179)2018 - 2019
  8. 日月光半導體製造股份有限公司- 「薄殼翹曲模組建立及最佳化設計」(N108215)2019 - 2020
  9. 日月光半導體製造股份有限公司- 「封膠材料關鍵特性在Fan out 封裝製程應用之研究」(N110232)2021 - 2022
其他
  1. 國立中山大學高雄醫學大學攻頂聯盟102年度合作研究計畫-應用 於脊椎肌肉活化訓練之可撓應變感測模組開發 (NSYSUKMU 2013–P033)2013 - 2014
  2. 國立中山大學高雄醫學大學攻頂聯盟103年度合作研究計畫-脊椎 肌肉活化訓練系統開發(NSYSUKMU 103-P027)2014 - 2015
  3. 國立中山大學高雄醫學大學攻頂聯盟104年度合作研究計畫-應用於脊椎肌肉活化訓練之可撓感測器最佳化(NSYSUKMU 104-P029)2015 - 2016
  4. 國家中山科學研究院-「匿聲推進技術與評估及市場分析」(N107121)2018 - 2019
專利
  1. 可撓性感測器及設有可撓性感測器之量測裝置2016
  2. 肌肉訓練輔助裝置2017
  3. 熱膨脹係數檢測系統及方法2019
榮譽事項
  1. 101學年度第2學期優良課程 - 機電材料2013
  2. 102學年度第1學期優良課程 - 半導體製程導論2013
  3. 2014"A method Integrating Optimal Algorithm and FEM on CMOS Residual Stress" selected by Advances in Engineering as a Key Scientific Article2014
  4. 2014-2018 經濟部工業局綠色工廠標章清潔生產技術審查委員2014
  5. 103學年度第1學期學士班「名師領航」課程 - 半導體製程導論2014
  6. 2015-2017 工程技術中心綠色能源組組長2015
  7. 2015 "Who's Who in the World 32th" collected.2015
  8. 2015"The robustness of an algorithm applied in wafer-level material property extraction" selected by Advances in Engineering as a Key Scientific Article.2015
  9. 2015科技部工程司自動化學門微機電系統及微奈米科技規劃委員2015
  10. 103學年度第2學期優良課程 - 科技前沿2015
  11. 2016-2018台灣機電工程國際學會第一屆秘書長2016
  12. 2017 Albert Nelson Marquis Lifetime Achievement Award2017
  13. 105學年度第2學期優良課程 - 科技前沿2017
  14. 106學年度第1學期優良課程 - 半導體製程導論2017
  15. 2018 "Who's Who in the World" collected.2018
  16. 2018 Albert Nelson Marquis Lifetime Achievement Award.2018
  17. 106學年度第2學期優良課程 - 科技前沿2018
  18. 107學年度第1學期優良課程 - 科技前沿2018
  19. 107學年度第1學期優良課程 - 半導體製程導論2018
  20. 2019 Lifetime Achievement Award2019
  21. 2019 "Who's Who in the World" collected.2019
  22. 中華民國力學學會第37屆科普委員會委員2019
  23. 108年度產學激勵獎2019
  24. 107學年度第2學期優良課程 - 科技前沿2019
  25. 107學年度第2學期優良課程 - 機電材料2019
  26. 108學年度第1學期優良課程 - 科技前沿2019
  27. 108學年度第1學期優良課程 - 半導體製程導論2019
  28. 2020 "Who's Who in the World" collected.2020
  29. 2020科技部南部科學園區管理局 ｢半導體製程導論｣ 論壇講師2020
  30. 108學年度教學績優教師2020
  31. 109學年度第1學期優良課程 - 半導體製程導論2020
  32. 2021-2024 中國機械工程學會女力發展委員會委員2021
  33. 2021 "Who's Who in the World" collected.2021
  34. 109學年度教學績優教師2021
  35. 110學年度第2學期優良課程 - 半導體製程導論(榮獲全英語授課獎勵)2022
  36. 112年度台灣機電工程國際學會年輕機電工程科技學者獎2023
  37. 111學年度第2學期優良課程 - 半導體製程導論(榮獲全英語授課獎勵)2023

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