國立成功大學工程科學系

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陳榮盛 退休教授
介紹
陳榮盛照片
姓名:
陳榮盛
職稱:
退休教授
專長:
固體力學、封裝結構應力分析 、微機電系統設計分析與奈機電系統設計分析 、光電磁儲存元件製造技術, 光顯示元件製造技術、光通訊原理與應用、有線與無線通訊原理與應用、太陽能電池製造技術
經歷
起迄時間
名稱
期刊論文
  1. Hsin-En Cheng, Rong-Sheng Chen, Chao-Yang Mao, “Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip BGA by Using the Optimal Equivalent Solder balls has been accepted for publication in the Quality and Reliability Engineering International Journal on Oct. 18, 2013.
  2. R.S. Chen *, C.H. Huang, Y.Z. Xie,2012,” "Application Of Optimal Design On Twin Die Stacked Package By Reliability Indicator Of Average SED Concept", Journal of Mechanics,March, Vol. 28, No. 1,pp135-142
  3. L.C. Tsao, C.H. Huang, C.H. Chung, R.S. Chen, 2012, "Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder", Materials Science and Engineering: A
  4. R.S. Chen, H.E. Cheng, R.W. Wu, C.H. Huang, W.C. Liao, J.H. Chuang, 2011,"Optimal Design of TFBGA Package under Drop Impact Test" Journal of Mechanical Engineering Science, Dec.,Vol 225,Issue12, pp.2775-2791.
  5. R. W. Wu, L. C. Tsao, S. Y. Chang, C. C. Jain, R. S. Chen, 2010, "Interfacial Reactions between Liquid Sn3.5Ag0.5Cu Solders and Ag" Journal of Materials Science: Materials in Electronics ,Vol 22, No. 8, pp.1181-1187.
  6. Ping-Feng Yang,Sheng-Rui Jian,Yi-Shao Lai, Rong-Sheng Chen, 2009, "Nanotribological Characteristics of Cu6Sn5, Cu3Sn, and NiSn4 Intermetallic Compounds", Journal of Electronic Materials, Vol.38, No.6, pp.810-814.
  7. Ping-Feng Yang, Sheng-Rui Jian, Sean Wu, Yi-Shao Lai,Chung-Ting Wang, Rong-Sheng Chen,2009,"Structural and Mechanical Characteristics of (103) AlN Thin Films Prepared by Radio Frequency Magnetron ", Applied Surface Science, Vol.255, Issue 11, March, pp5984-5988.
  8. Ying-Chih Lee, Bor-Tsuen Wang, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen, 2008," Finite Element Model Verification for Packaged Printed Circuit Board by Experimental Modal Analysis", The Journal of Microelectronics Reliability, Vol.48, Issue 11-12, Nov.-Dec. pp.1837-1848.
  9. Tsung-Yueh Tsai, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen, 2008,"Structural Design Optimization for Board-level Drop Reliability of Wafer-level Chip-scale Packages", The Journal of Microelectronics Reliability, Vol. 48, pp.756-762.
  10. Yang, Ping-Feng, Jian, Sheng-Rui, Lai, Yi-Shao, Yang, Chu-Shou, Chen, Rong-Sheng, 2008, "Morphological, Structural, and Mechanical Characterizations of InGaN Thin Films Deposited by MOCVD" Journal of Alloys and Compounds, Vol.463, No.1-2, pp.533-538.
  11. Yang, P.F., Wen, H.C., Jian, S.R., Lai, Y.S., Wu, S., Chen R.S., 2008, "Characteristics of ZnO Thin Films Prepared by Radio Frequency Magnetron Sputtering" The Journal of Microelectronics Reliability, Vol. 48, pp.389-394.
  12. Yang, P. F., Lai, Y. S., Jian, S. R., Chen, J., Chen, R. S., 2008, "Nanoindentation Identifications of Mechanical Properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds Derived by Diffusion Couples", Materials Science and Engineering: A, Vol. 485, pp.305-310.
  13. Mao, C. Y., Chen, R. S., 2008, "Packaging Parameter Analysis and Optimization Design on Solder Joint Reliability for Twin Die Stacked Packages by Variance in Strain Energy Density (SED) of Each Solder Joint", The Journal of Microelectronics Reliability, Vol. 48 pp.119-131.
  14. Chen, R.S., Mao, C. Y. Chen, Y. S., 2007, "Improvement of Temperature Uniformity for Polymerase Chain Reaction Chip with Heat Spreader", Japanese Journal of Applied Physics, Vol.46,No.11,pp.7530-7535.
  15. Lin, Heng-Cheng, Kung, Chieh, Chen,Rong Sheng, 2007,“Evaluations of the BGA Solder ball Shape by Using Energy Method”, CMC: Computers, Materials & Continua, Vol.6, No.1, pp.43-50.
  16. Tsai, T. Y., Yeh, C. L., Lai, Y. S., Chen, R. S., 2007, "Response Spectra Analysis for Undamped Structural Systems Subjected to Half-sine Impact Acceleration Pulses", The Journal of Microelectronics Reliability, Vol.47, No. 8, pp1239-1245.
  17. Tsai, T. Y., Yeh, C. L., Lai, Y. S., Chen,R.S.,2007, " Transient Submodeling Analysis for Board-level Drop Tests of Electronic Packages" The IEEE Transactions on Electronics Packaging Manufacturing,Vol.30,No.1.pp54-62.
  18. Chen, R. S., Tseng, S. C, Wan, C. S., 2006, "Effects of Solder Joint Structure & Shape on Thermal Reliability of Plastic Ball Grid Array Package", International Journal of Advanced Manufacturing Technology, Vol.27, No.7-8, pp.677-687.
  19. Lin, H. C., Kung, C., Chen, R. S., Liang, G. T., 2006, "An Optimization Analysis of UBM Thickness and Solder Geometry on A Wafer Level Chip Scale Package Using Robust Methods", Computers, Materials & Continua, Vol.3, No.2, pp.55-64.
  20. Tseng, S. C., Chen, R. S., Lio, C. C., 2006, "Stress Analysis of Lead-Free Solder With Under Bump Metallurgy of a Wafer Level Chip Scale", International Journal of Advanced Manufacturing Technology, Vol.31, No.1-2, pp.1-9.
  21. Kung, C., Chen, R. S., 2005, "Fatigue Analysis of U-shaped Flexural Electro-thermo Micro-actuators", Journal of the Chinese Institute of Engineers, Vol. 28, pp.123-130.
  22. Chen, R.S., Kung, C., Lee, G.B., 2002.4, "Analysis of the Optimal Dimension on the Electrothermal Microatuator", Journal of Micromechanics and Microengineering, Vol.12, pp.291-296.
  23. Lee, G.B., Chen, R, S., Kung, C., 2002.4, "Analysis of the Optimal Inclined Angles on V-Shaped Electro-Thermal Micro actuators", Journal of the Chinese Society of Mechanical Engineers,Vol.23, No.2, pp.155-162.
  24. Chen, R.S., Lin,H.C., Kung C., 2000.1,"Optimal Dimension of PQFP by Using Taguchi Method", Journal of Composite Structures, UK, pp.1-8.
  25. Huang,D.Y., Chen,R.S.,1999.11, "Bonding Strength at Solid-Melt Interface for Polystyrene in a Sequential Two-Staged Injection Molding Process", Journal of Polymer Engineering and Science, U.S.A., pp.2159-2171.
  26. Chen,R.S., Hua,Y.S., Huang D.Y., 1999.9, "Modified Theory of Welding Line and Optimal Design of Material Parameter for a Thin Part in the Injection Mould", Journal of Polymer Engineering, UK., pp.419-443.
  27. Chen,Rong-Sheng, Tsai,Hsin-Shin, 1997.3, "Thermoviscoelastic Uniaxial Response for Varied Temperature and Constant Hydrostatic Pressure", Journal of the Chinese Society of Mechanical Engineering
  28. Chen,R.S., Lee,H.H., Yu,C.Y., 1997.1, "Application of Taguchi’s Method on the Optimal Process Design of an Integration Molded PC/PBT Automobile Bumper", Journal of Composite Structure, UK., pp. 209-214.
  29. Lee,H.H., Chen,R.S., Cheng,T.R., 1996.11, "Finite Element of 2-D Thermo-Viscoelastic Responses Based on the Free Volume Theory and a Recursive Formulation", Journal of Polymer Engineering and Science,U.S.A., pp.2634-2644.
  30. Chen,R.S., Wu,P.C., 1995.4, "Approach of the Special Finite Element for Honey-core Composites", Journal of Computers and Structures, U.S.A., pp.681-689.
  31. Chen,R.S., Chu,C.H., Chen,J.W., 1995.1, "Large Deformationof Hygrothermovis-coelasticity for Environmental Effected on the Cross-ply Laminates". The Composite Material of the ASME Energy Technology, U.S.A., pp.65-76.
  32. Chen,R.S, 1994.4, "The Effect of Curing Process on Mechanical Properties of the Honey-Core Sandwich Plate", Journal of Composites Engineering, U.S.A., pp.445-448.
  33. Chen,R.S., Tu, C.Y.,and Tsai,H.S., 1993.12, "The Effects of Moisture upon the Optimal Temperature Path of the Viscoelastic Symmetric Composite Laminates after Post Cure", Journal of Composite Material, U.S.A., pp.1578-1597.
  34. Chen,R.S., Chen,G.S., Chen,J.R., 1993.7, "The Effect of Environmental Humidity After Post Cure on the Optimal Temperature Path of the Polymer Composites,Journal of Composite Structures", Scotland, UK., pp.101-111.
  35. Chen,R.S.,Tu C.Y., Chen,G.S., 1993.6, "The Residual Thermal Stress Due to Cooldown of Post Cure for the Symmetric Cross-Ply T.C.M Composite Structure", UK., pp.155-166.
  36. Chen,R.S., 1987.6, "Hygrothermal Response of Graphite/Epoxy Composites", The Ohio State University Ph.D. Dissertation.
  37. Haper,B.D., Saab,G.H., Chen,R.S., 1987.3," A Note on the Effects of Voids upon the Hygral and Mechanical Properties of AS4/3502 Graphite/Epoxy", Journal of Composite Materials, Vol.21, pp.280-289.
  38. 陳榮盛,曾穗卿,葉裕德,劉景玉, 2004.12,"溫度循環作用下負載形式、黏塑性材料參數與有限元素網格切割對MLBGA構裝可靠度分析之影響",中華民國力學期刊系列B,第十九卷,第2期pp.103-112.
  39. 李國賓,陳榮盛, 2001.2,"微型電熱式致動器與其在微型光學上之應用",台大工程學刊,第82期, pp.1-10.
  40. 陳榮盛,黃富勇,黃登淵,1998.12, "塑膠射出成型之材料參數對縫合強度的最佳化設計",高雄科技學報,第20期, pp.97-114.
  41. 陳榮盛,黃登淵,林煌益,1998.12,"以澆口平衡觀點分析多澆口最佳位置",中華民國力學期刊，第十四卷,第2期, pp.141-145.
  42. 黃登淵,陳榮盛,曾宇譚,1997.12,"聚苯乙烯之縫合強度預估與製程參數的影響",中華民國力學期刊,第十三卷,第4期, pp.153-160.
  43. 陳榮盛,毛昭陽,黃登淵,1997.6, "以平衡流動觀點分析膜片澆口之最佳位置",中華民國力學期刊,第十三卷,第2期, pp.153-160.
  44. 陳榮盛，1997.3, "以連續疊代之有限元素法分析高分子材料圓孔中熱黏彈之應力集中現象",中華民國力學期刊，第十三卷，第1期, pp.113-116.
  45. 陳榮盛,陳健興,宋光濤, 1996.11,"專家系統在射出成型最佳製程設計上的應用",成大學報第三十一卷, pp.107-124.
  46. 陳榮盛,陳界文,梁智翔, 1996.6, "以田口氏實驗計畫法分析PU+金雲母材質應用於射出成型加工之製程研究",中華民國力學期刊，第十二卷，第2期，pp.107-124.
  47. 陳榮盛,陳健儒,鄭尊仁, 1995.12,"利用自由體積理論分析受周圍環境影響之二維熱黏彈反應",中華民國力學期刊,第十一卷,第4期,pp.357-368.
  48. 陳榮盛,丁緯平,陳界文,1995.11, "玻璃鱗片補強聚氨脂於射出成型之機械性質探討",成大學報第三十卷,pp.63-84.
  49. 陳榮盛,陳建安,1995.9, "雲母鱗片添加於熱塑性聚氨脂之機械性質探討",中華民國力學期刊,第十一卷,第3期,pp.167-176.
  50. 陳榮盛,朱俊鴻,1994.12, "利用溼熱黏彈有限單元分析環境因素對反對稱層板之力學現象",中華民國力學期刊第十卷，第4期pp.297-309.
  51. 陳榮盛,郭進明,1993.12, "硬化歷程對石墨/環氧樹脂-Aramid 蜂巢夾心結構機械性質影響",中國土木水利工程學刊,第五卷,第3 期,pp.217-226.
  52. 陳榮盛,黃肇義,涂振一,1993.3, "周圍濕氣對黏彈性複材於維護過程後熱殘留應力之影響",中華民國力學期刊,第九卷,第1 期,pp.59-68.
  53. 陳榮盛,林勝鴻,1992.9, "複合層板契形體之應力奇異性分析",中國力學期刊,第八卷,第3 期,pp.227-238.
  54. 蔡佳璋,陳榮盛,1992.6, "延展性圓周裂紋之不穩定分析",中華民國力學期刊,第八卷,第2 期,pp.151-157.
  55. 謝鴻祥,陳榮盛,1992.3, "圓柱型複合層殼橫向剪應力之探討",中華民國力學期刊,第八卷,第1 期,pp.49-59.
  56. 陳榮盛,楊雅屹,1991.12, "反對稱正交疊合之層板受環境因素影響之黏彈分析",中國土木水利工程學刊,第三卷,第4 期,pp.289-298.
  57. 王正吉,陳榮盛,1990.12, "以三維修正之複合應力元素應力法分析複合層板圓孔之應力集中現象",中國土木水利工程學刊,第二卷,第4 期,pp.337-345.
  58. R. Chen, H. Cheng, C. Huang and R. Wu, "Optimal Design of Thermal Dissipation for the Array Power LED by using the RSM with Genetic Algorithm,"Modeling and Numerical Simulation of Material Science, Vol. 3 No. 1, 2013, pp. 12-26.
  59. L. C. Tsao, R. W. Wu, M. W. Wu, C. H. Huang ,R. S. Chen, 2013, "Formation of ultrafine structure in as cast Ti7CuXSn alloys",Materials Science and Technology, Vol.29, No.12, pp.1529-1536.
  60. L.C. Tsao , R.W.Wu , Te-Hsien Cheng , Kuo-Huan Fan , R.S.Chen ,2013, "Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads",Materials and Design, Vol.50, pp.774-781.
  61. Hsin En Cheng, Rong Sheng Chen, Aug. 2014, "Interval Optimal Design of 3-D TSV Stacked Chips Package Reliability by Using the Genetic Algorithm Method" has been accepted for publication in Microelectronics Reliability.
  62. Hsin-En Cheng, Rong-Sheng Chen, Chia-Ming Lin “Optimal Design of Fatigue Life for RCP with PoP Package by using the Taguchi Method”
研討會論文
  1. Chen,Rong-Sheng, Cheng,Hsin-En, Mao,Chao-Yang,Oct. 2010,"Packaging parameters analysis of stacked chip BGA with optimal equivalent solder for fatigue reliability optimization",12th Electronics Packaging Technology Comference,Singapore.
  2. Chen,Rong-Sheng, Wu,Rey-Wen, Liao, Wen-Chi,Dec. 2010,"Optimal Design of Drop Impact for TFBGA by Concept of Average Stress within Finite Grid Region",12th Electronics Packaging Technology Comference,Singapore.
  3. Chen,Rong-Sheng, Huang,Chi-Huang, Xie,Yue-Zhe,2010,"The application of the Optimal Design on Twin Die Stacked Package through the Pattern Search Method",In Proceedings of IMPACT ( 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference), Nangang Exhibition Center, Taipei.
  4. Chen,Rong-Sheng, Cheng,Hsin-En, Mao,Chao-Yang, 2010,"Analysis of Fatigue Reliability for the Stacked Chip BGA Package by the Optimal Equivalent Solder Viewpoint", In Proceedings of IMPACT ( 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference), Nangang Exhibition Center, Taipei.
  5. Chen,Lung-Tai, Hsu,Yu-Wen, Fang,Pzu-Jui and Chen,Rong-Sheng, 2010,"packaging Effect Investigation for MEMS-based Sensors WL-CSP with a Central Opening",the Electronic Compnents and Technology Conference,pp.1689-1695.
  6. Chen,Lung-Tai, Hsu,Chung-Yi, Chang,Jin-Sgeng, hu,Chun-Hsun,Cheng,Woo-Hi, Xie,Yue-Zhe and Chen,Rong-Sheng 2009, " A Tiny Plastic Package of Pressure Sensors Fabricated Using the Lithographic Dam-ring Approch", the Electronic Compnents and Technology Conference,pp.1676-1681.
  7. Chen, L.T., Hsu, C.Y., Chang J.S., Chu, C.H.,Xie, Y.Z, Chen,R.S., 2008, "Parameter Study of MEMS-Based Pressure Sensor Package Constructed by Dam-Ring Approach", Proc. the Asia-Pacific Conference on Micro-Nano Technology, Tainan, Taiwan, pp.159-162.
  8. Yang,Ping-Feng, Jian, Sheng-Rui, Lai, Yi-Shao, Chen, Rong-Sheng, 2008, "Nanotribological Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds Developed by Diffusion Couples", 2008, In Proceedings of IMPACT ( 3nd International Microsystems, Packaging, Assembly and Circuits Technology Conference)/10rd EMAP joint conference.
  9. Lin, H. C., Kung, C., Chen,R. S.,2007, "Taguchi Robust Analysis of Fatigue Of Lead-Free Sn3.5Ag Solders", International PACK2007 (ASME, EI), IPACK2007-33597.
  10. Lin, H. C. , Kung, C., Chen,R. S., 2007, "Evaluate the Effects of Solder Pad Radius of a MCM package with Sn3.5Ag Solder Balls on the Fatigue Life of the Solders", ICEP, pp268-273.
  11. Tsai, T. Y., Yeh, C. L., Lai, Y. S., Chen, R. S., 2007, "Incorpating Response Spectra and Modal Superposition in Analzing Transient Responses of Structural Systems Subjected to half-sine Impact Acceleration Pulse" In Proceedings of ECTC 2007 (57th Electronic Components And Technology Conference), Reno, NV, USA, pp.543-547.
  12. Yang, P. F., Lai, Y. S., Jian, S. R., Chen, J., Chen, R. S., 2007, "Identifications of Mechanical Properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds Using Nanoindentation" In Proceedings of IMPACT ( 2nd International Microsystems, Packaging, Assembly and Circuits Technology Conference).
  13. Yang, P. F.,Wen, H. C., Jian, S. R.,Lai, Y. S., Wu,S., Chen, R. S, 2007, "Characterization of ZnO Thin Films Desposited onto Langasite Substrates by Magnetron Sputtering", In Proceedings of IMPACT ( 2nd International Microsystems, Packaging, Assembly and Circuits Technology Conference).
  14. Yang, P. F., Jian, S. R., Lai, Y.S., Chen, T. H. Chen, R.S., 2006, "Nanoindentation-induced Phase Transformation of Silicon", IMPACT 2006 (1st International Microsystems, Packaging, Assembly and Circuits Conference Taiwan), pp. 119-122.
  15. Tsai, T. Y., Yeh, C.L., Lai, Y.S., Chen, R. S., 2006, "Nonlinear Transient Submodeling Analysis for Board-level Drop Tests", IMAPS Taiwan 2006 International Technical Symposium, pp. 185-193.
  16. Mao, C. Y., Chen, R. S., 2006. Sep. 5-9, "Packaging Parameter Analysis on Solder Joint Reliability for Twin Die Stacked Packages by Variance in Strain Energy Density of Each Solder Joint", 1st Electronics System Integration Technology Conference (ESTC 2006), Dresden, Germany, pp.934-941.
  17. Mao, C. Y., Chen, R. S., 2006.Sep. 5-9, "The Improvement of Temperature Uniformity for Polymerase Chain Reaction Chip with a Micro-hotplate (Nickel)", 1st Electronics Systemintegration Technology Conference(ESTC 2006), Dresden, Germany, pp.1242-1248.
  18. Mao, C. Y., Chen, R. S., 2006/6/29-30, "The Optimal Design of Stacked Die Packages for Minimizing the Risk of Interfacial Delamination using Taguchi Method", IMAPS Taiwan 2006 International Technical Symposium, pp.23-29.
  19. Kung, C., Lin, H. C., Chen, S. H., Chen, R. S., 2006/6/29-30, "Parametric Study on the Fatigue Reliability of the Lead-free Sn3.5Ag on a Multi-chip (MCM) Package Subjected to Temperature Cycling", IMAPS Taiwan 2006 International Technical Symposium, pp.303-310.
  20. Kung, C., Lin, H. C., Chen, S. H., Chen, R. S., 2006/6/29-30, "On Evaluations of BGA Solder Shape Using Surface Evolver", IMAPS Taiwan 2006 International Technical Symposium, pp.296-302.
  21. Mao, C. Y., Chen, R. S., Chen Y. S., 2006.March 29-31, "The Analysis on Optimal Temperature Control of Polymerase Chain Reaction by The Fuzzy Method", The second International Symposium on Micro & Nano Technology (ISMNT-2), Hsinchu , Taiwan, pp.205-209.
  22. Kung, C., Chen, R. S., Lin, H. C. , Win, T. K.,2005,7 "Optimization of UBM for WLCSP Fatigue Reliability", Proceedings of International Microelectronic and Package Conference, p.221-p.231.
  23. G. B. Lee, H. I. Tsai, C. S. Shey, R. S. Chen, J. Kan, 2000.6, "Analysis of Electro-Thermal Bent-Beam Actuators and Their Applications on Micro Grippers/Micro Opics", The 7th International Conference on New Actuators(Actuator 2000).
  24. Chen,R.S.,Hwang,S.V., 1996.3, "Gate Location Optimization for Automobile Front Fender", Proceedings of 1996 C-MOLD Asia-Pacific User＇s Conference,Hsinchu, Taiwan, R.O.C., pp501-513.
  25. Chen,R.S., Lee,H.H., Yu,C.Y., 1995.3, "Process Optimization for the Car PC/PBT Bumper", Proceedings of 1995 C-MOLD Asia-Pacific User＇s Conference, Hsinchu, Taiwan, R.O.C, pp0301-0308.
  26. Chen,R.S., Chen,J.R., 1994.8, "Analysis of Free Volume Theory of Thermo-viscoelastic Response at Varied Temperature", International Conference on Composite Engineering, New Oleans, U.S.A., pp.667-668
  27. Chen,R.S., Tu.C.Y., 1993.2, "The Residual thermal Stress Due to Cool-down of Curing Process for T.C.M. Viscoelastic Composite Material", Advanced Composites＇93, International Conference on Advanced Composites, Australia, pp.929-936.
  28. Chen,R.S.,1993.1, "The Effect of Curing Process on Mechanical Properties of the Honeycombcore Sandwich plat", The Composite Material of the ASME Energy Technology Conference, Houton, Texas,U.S.A., pp309-316.
  29. Chen,R.S.,Tu,C.Y.,and Wu,P.C., 1992.6, "The Environmental Effect on the Hygrothermo-viscoelastic Composite Material", Society for Experimental Mechanics,International Composite Material,Society for Experimental Mechanics, International Congress on Experimental Mechanics, Las Vegas, Nevada U.S.A., pp.938-945.
  30. Chen,R.S., 1991.10, "The Effect of Humidity on the Residual thermal Stress of the Fabricated Viscoelastic Composite Material", The Polymer Processing Society International/Asia and Australia Regional Meeting, Shanghai, China, pp.143-144.
  31. 陳榮盛,陳永翰,潘嘉偉,張協智,2011,12, "以AC 電滲流驅動流體觀點分析平行板收集器於不同收集窗口形狀下影響效率之多因子最適組合設計",中國機械工程學會第28屆全國學術研討會,國立中興大學,台中市
  32. 陳榮盛,黃子軒,黃奎元,2011,11, "利用反應曲面法配合基因演算法分析陣列式高功率LED構裝散熱之最佳設計",中華民國力學學會第三十五屆全國力學會議,國立成功大學,台南市
  33. 陳榮盛,廖文基,潘嘉偉,2010.11,"田口法分析TFBGA掉落衝擊之最佳化設計",中國機械工程學會第二十七屆全國學術研討會,國立台北科技大學,台北市.
  34. 陳榮盛,羅盛沐,袁揚承, 2010.11 "以區間式遺傳演算法進行堆疊晶QFN構裝體疲勞壽命之區間最佳化設計",中華民國力學學會第三十四屆全國力學會議 國立雲林科技大學,雲林縣
  35. 楊秉豐,簡賸瑞, 陳國駒,賴逸少, 王中鼎, 陳榮盛,2010.11,"氮化鋁薄膜於奈米壓痕變形之穿透式電子顯微解析之特性研究",材料年會,義守大學,高雄縣
  36. 陳榮盛,方子睿,2009,11,"以基因演算法進行堆疊晶QFN構裝體疲勞壽命之最佳化設計",中華民國力學學會第三十三屆全國力學會議,聯合大學,苗栗市.
  37. 陳榮盛,楊欣儒, 張良漢, 方子睿,2009.11,"半導體量測機台減少污染粒子之方法與分析",中國機械工程學會第二十六屆全國學術研討會,成功大學,台南市.
  38. 陳榮盛,陳彥文,2008.11,"以田口式品質工程分析堆疊晶QFN構裝體疲勞壽命之最佳化探討", 中華民國力學學會第三十二屆全國力學會議, 中正大學,嘉義縣.
  39. 陳榮盛,謝岳哲,毛昭陽,黃棋煌,2008,11-21、22, "以反應曲面法分析相同尺寸晶片堆疊式封裝之最佳化設計"中國機械工程學會第25屆全國學術研討會，大葉大學,彰化縣
  40. 楊秉豐、簡賸瑞、賴逸少、王中鼎、邵郁琇、陳榮盛, 2008,"錫銅與錫鎳介金屬相之奈米尺度磨耗特性探討",中華民國力學學會第三十二屆全國力學會議國立中正大學機械工程學系,pp.28-29.
  41. 楊秉豐,簡賸瑞,賴逸少,王中鼎,吳信賢,陳榮盛,2008,"射頻磁控濺鍍(103)氮化鋁薄膜之奈米結構之機械特性研究",中國材料科學學會年會.
  42. 陳榮盛,張家豪,2007.12,"以田口式品質工程分析QFN構裝體疲勞壽命之最佳化探討", 中華民國力學學會第三十一屆全國力學會議, 義守大學, 高雄縣.
  43. 楊秉豐,賴逸少,簡賸瑞,陳駿,陳榮盛, 2007.11, "錫銅與錫鎳介金屬相之機械性質研究", 第二十四屆機械工程研討會,中原大學, 中壢市.
  44. 楊秉豐,簡賸瑞,溫華強,賴逸少,陳燦賢,吳信賢,陳榮盛, " 射頻磁控濺鍍氧化鋅薄膜之結構與奈米尺度機械特性研究", 2007.11, 2007中國材料科學年會,P07-025,國立交通大學,新竹市.
  45. 陳榮盛,宋進祥, 2006.12,“積層陶瓷電容器之可靠度評估與失效分析＂, 中華民國力學學會第三十屆全國力學會議, D2-2 pp.161.
  46. 蔡宗岳,葉昶麟,賴逸少,陳榮盛, 2006.12,“上板電子封裝封裝掉落衝擊測試之暫態非線性次模型分析＂, 中華民國力學學會第三十屆全國力學會議,L1-3 pp.269.
  47. 龔傑,林恆正,陳榮盛, 2006.12,“錫球黏著店尺寸對含無鉛錫球Sn3.5Ag 多晶片模組錫球壽命的影響＂, 中華民國力學學會第三十屆全國力學會議, L1-6 pp.270.
  48. 陳榮盛,閻慶昌,陳仕祥,張家豪, 2006.12,“QFN 構裝體錫球接點結構探討＂, 中華民國力學學會第三十屆全國力學會議, L3-2 pp.275.
  49. Ping-Feng Yang, Sheng-Rui Jian, Yi-Shao Lai, Tsan-Hsien Chen, Rong-Sheng Chen, 2006 ,“Nanoindentation-induced phase transformation of silicom＂, International Microsystems Packaging Assembly, pp114-117.
  50. 楊秉豐, 簡賸瑞, 溫華強, 陳燦賢, 賴逸少, 陳榮盛, 2006 ,“矽在奈米壓痕下的相變化探討＂, P07-002,材料科學年會.
  51. 楊秉豐, 簡賸瑞, 陳燦賢,賴逸少,陳榮盛, 2006,“氮化鎵薄膜之奈米壓痕特性研究＂, E2-033, Proceedings of the 23th National Conference on Mechanical Engineering.
  52. 毛昭陽, 陳榮盛, ＂應用田口方法分析堆疊晶片封裝體對減少介面脫層之最佳化設計＂, 第二十二屆機械工程研討會,桃園,中央大學,Nov.2005
  53. 陳榮盛,龔傑,林恆正,溫從凱,＂利用G/L 方法探討WLCSP 構裝含UBM 錫球之疲勞壽命＂, 第二十二屆機械工程研討會,桃園,中央大學,Nov.2005
  54. 蔡宗岳, 葉昶麟, 賴逸少, 陳榮盛, 2005, “半正弦衝擊波型式掉落衝擊測試之反應頻譜分析理論架構＂, 中華民國力學學會第廿九屆全國力學會議, L019.
  55. 陳榮盛,毛昭陽,蔡宗岳,李育嘉,＂對堆疊式晶片構裝疲勞壽命之最佳化探討＂, 第二十九屆全國力學會議,清華,Dec.2005.
  56. Cheng-Yuan Tang, Rong-Sheng Chen, Hong-Long Chou, Yueh-Hung Lai, and Chien-Chin Peng, “Using Genetic Algorithms to Estimate Fundamental Matrices,＂ Proceedings of Computer Vision, Graphics and Image Processing (CVGIP 2005), Taipei, 2005.
  57. 唐政元、陳榮盛、賴岳宏、廖怡儂、林宥丞, “使用田口基因演算法來估測基礎矩陣,＂ 第十六屆國際資訊管理學術研討會(ICIM 2005), 台北, 輔仁大學, 2005.
  58. 陳榮盛,劉振中,曾穗卿, ＂無鉛錫球含多金屬薄膜之晶圓級封裝結構分析＂, 第二十一屆機械工程研討會,高雄,中山大學, Nov. 2004(主持人).
  59. 陳榮盛,郭聰敏,劉志強, ＂微致動器雙層懸臂良之尺寸最佳化分析＂, 第二十八屆全國力學會議,台大, Dec. 2004.
  60. 陳榮盛,李國賓,李輝煌,吳英信,＂微晶片聚合酶連鎖反應器效率之評估＂, 第二十屆機械工程研討會,台北,台大,Dec.2003(主持人)
  61. 龔傑,陳榮盛,李輝煌,邱重榮,＂電熱式微致動器疲勞實驗與分析＂,第二十屆機械工程研討會,台北,台大,Dec.2003
  62. 陳榮盛,李輝煌,龔傑,李國賓,劉政志,陳永祥,＂微幫浦最佳效能設計＂, 第十九屆機械工程研討會,雲林,虎尾技術學院,Dec.2002.
  63. 龔傑,陳榮盛,邱重榮,＂微型熱致動器疲勞試驗與分析＂, The 6th Nano Engineering and Micro System Technology Workshop, Taiwan, Nov.2002.
  64. 陳榮盛,李國賓,李輝煌,陳永祥,＂聚合酶連鎖反應晶片之分段式溫動控制邏輯分析,＂2002 Taiwan ANSYS Users Conference,Nov.2002
  65. 陳榮盛,葉裕德,曾穗卿,＂有限元素網格切割對二維MLBGA 構裝模型數值分析之影響＂ 第十八屆機械工程研討會,台北,台北科技大學,Dec.2001(主持人)
  66. 陳榮盛,劉景玉,葉裕德,＂溫度循環作用下黏朔性材料參數與有限元素網格切割對MLBGA 構裝可靠度分析之影響＂, 第十八屆機械工程研討會,台北, 台北科技大學,Dec.2001
  67. 陳榮盛,劉景玉,曾穗卿, ＂溫度循環作用下黏朔性錫球結構與負載形式對MLBGA 構裝之可靠度探討＂, 第十八屆機械工程研討會,台北,台北科技大學,Dec.2001
  68. 謝宸碩,李國賓,陳榮盛,＂熱動式微致動器之設計製作及其在微爪之應用,＂ 25th National Conference on Theoretical and Applied Mechanics,ROC,2001.
  69. Gwo-Bin Lee, Han-I Tsai Chen-Sho Shey , Rong-Sheng Chen , Jey Kuan, ＂Modelization and Characterization of Electro-thermal Bent-Beam Actuators,＂First Cross-Strait Symposium on Microsystem Technologies, Taiwan, May 2000.
  70. 李國賓,陳榮盛,蔡瀚毅,謝宸碩,龔傑,＂V 型彎曲懸樑結構之熱動微致動器最佳角度之探討,＂The 6th Annual MEMS Conference, Taipei ,Taiwan ,ROC., March 2000.
  71. 陳榮盛,曾穗卿,黃雯玲,＂覆晶構裝中錫球受黏彈性充填材料影響之最佳化探討,＂力學學會年會暨第二十四屆全國力學會議.Dec.2000
  72. 李國賓,陳榮盛,歐憲璋,林彥亨,龔傑,＂熱動式微致動器尺寸效應之探討,＂ The 23rd National Conference on Theoretical and Applied Mechanic,ROC,Dec.1999
  73. 李國賓,陳榮盛,歐憲章, 龔傑,＂ 熱動式微致動器尺寸最佳化之探討,＂第二十三屆全國力學會議,新竹市,Dec.1999，pp.39
  74. 陳榮盛,徐仕明,曾穗卿,＂功率循環作用下錫球材料非線性行為對BGA 構裝可靠度之影響分析＂, 第十六屆機械工程研討會,新竹,清華大學,Dec.1999，pp.364
  75. 陳榮盛,徐孟仁,"玻璃鱗片含量對耐蝕塗料之接著強度與耐磨耗性及抗溼熱循環性質",第十七屆國立學會議,台北市,Dec.1993，pp.935-940.
  76. 陳榮盛,'楊雅屹,"熱黏彈性複合材料受周圍環境因素之影響",第十五屆國立學會議,台南市,Dec.1991，pp.921-928.
  77. 陳榮盛,黃肇義,涂振一,＂積層維護後周圍濕氣對黏彈複姓材料熱殘流應力之影響＂ ,第八屆中國機械工程研討會
  78. 陳榮盛,林逸倫,余健源,2013,12"基因遺傳演算法進行RCP疊合封裝體疲勞壽命之區間是最佳化分析 ",中國機械工程學會第30屆全國學術研討會,國立宜蘭大學,宜蘭市。
  79. 陳榮盛，朱學良，方怡平, 2013.11, "Interval Optimization of Fatigue Life for PoP Package by Genetic Algorithm",中華民國力學學會第三十七屆全國力學會議，新竹市清華大學。
  80. 陳榮盛,潘嘉偉,林逸倫, 2012.12, "探討關鍵錫球所累積平均應變能密度之反應曲面於FCOB 覆晶式載板接合封裝體之差異分析",中國機械工程學會第二十九屆全國學術研討會。
  81. 陳榮盛,張協智,朱學良,鄭信恩, 2012.11, "利用田口方法進行疊合封裝體可靠度之最佳化設計",中華民國力學學會第三十六屆全國力學會議。
國科會計畫
  1. 黏彈複材在編織過程中最佳溫度控制歷程,NSC79-0401-E-006-011,(78/08~79/07)1989 - 1990
  2. 熱黏彈性複材受周圍環境因素之影響,NSC80-0401-E-006-030,(79/08~80/07)1990 - 1991
  3. 結構之有限元素分析及破壞力學之探討,NSC81-0401-E-006-22,(80/08~81/07)1991 - 1992
  4. 濕度對編織後黏彈性複材其熱殘留應力之響性,NSC80-0401-E-006-053,(80/02~81/01)1992 - 1992
  5. 蜂巢蕊複材之特殊單元模式分析,NSC81-0401-E-006-586,(81/02~82/01)1992 - 1993
  6. 熱膨脹對TCM黏彈性複合材料在硬化製程之殘留應力影響,NSC82-0401-E-006-103,(81/08~82/07)1992 - 1993
  7. 直圓管圓周裂紋之彈性塑性分析,NSC82-0115-E-006-403,(82/02~83/01)1993 - 1994
  8. 玻璃鱗片含量對耐蝕塗料之耐蝕性及悟性探討,NSC84-2216-E-006-051,(83/08~84/07)1994 - 1995
  9. 利用自由體積理論分析不同溫度下之熱黏彈反應,NSC83(84)-0401-E-006-25(26),(83/02~84/07)1994 - 1995
  10. 以反覆疊代之有限單元法分析二維黏彈反應,NSC85-2212-E-006-012,(84/08~85/07)1995 - 1996
  11. 以反覆疊代之有限元素法分析高分子材料圓孔中熱黏彈之應力集中現象,NSC86-2212-E-006-008,(85/08~86/07)1996 - 1997
  12. 以流動平衡判斷多澆口之最佳位置,NSC87-2216-E-006-004,(86/08~87/07)1997 - 1998
  13. 對薄件縫合線理論之修正與材料參數的最佳化設計,NSC88-2212-E-006-027,(87/8~88/7)1998 - 1999
  14. 以有限元素法結合田口氏品質工程研究環境因素對BGA可靠度的影響,NSC89-2212-E-006-020,(88/08~89/07)1999 - 2000
  15. 在熱循環作用下錫球結構與配置方式對PBGA構裝之可靠度,NSC89-2212-E-006-124,(89/08~90/07)2000 - 2001
  16. 溫度循環作用下黏塑性錫球結構形狀與負載形式對MLBGA構裝之可靠度探討,NSC90-2212-E-006-069,(90/08~91/07)2001 - 2002
  17. 溫度循環作用下黏塑性材料參數與有限元素網格切割對MLBGA構裝可靠度分析之影響,NSC91-2212-E-006-092,(91/08~92/07)2002 - 2003
  18. 無鉛錫球含UBM之WLSP封裝結構應力分析,NSC92-2212-E-006-130,(92/08~93/07)2003 - 2004
  19. 利用模糊理論分析聚合酶連鎖反應晶片之最佳溫度控制(I),93-2212-E-006-098,(93/08~94/07)2004 - 2005
  20. 利用模糊理論分析聚合酶連鎖反應晶片之最佳溫度控制(II),94-2212-E-006-060,(94/08~95/07)2005 - 2006
  21. 以錫球間應變能密度差異探討雙相同尺寸晶片堆疊式封裝體疲勞壽命之參數分析與最佳化設計,95-2212-E-006-055,(95/08~96/07)2006 - 2007
  22. 將3D堆疊晶片加入QFN構裝中以提升功能之技術研發,96-221-E-006-221, (96/08~97/07)2007 - 2008
  23. 半導體量測機台減少污染粒子之方法與分析,97-2221-E-006-074(97/08-98/07)2008 - 2009
  24. 電子構裝受掉落衝擊之最佳化設計,NSC98-2221-E-006-057,(98/08-99/07)2009 - 2010
  25. 陣列式高功率LED 構裝散熱之研發,NSC 99-2221-E-006 -038,(99/08-100/07)2010 - 2011
  26. DCA晶片直接接合封裝體疲勞壽命最佳化設計之研究,NSC 100-2221-E-006-080,(100/08~101/07)2011 - 2012
其他
  1. 複材蜂巢蕊編織技術開發,工業局,(80/07~81/06)1991 - 1992
  2. 耐蝕塗料之技術開發,工業局,(81/07~82/06)1992 - 1993
  3. 汽車保險桿之開發與模擬,工業局,(83/07~84/06)1994 - 1995
  4. 汽車保險桿之製程研發,經濟部技術處,(83/01~83/06)1994 - 1994
  5. CAE對燈殼射出成型之研發,工業局,(84/07~85/06)1995 - 1996
  6. 以PA/PPE材質成型前葉子板之技術開發,工業局,(85/07~86/06)1996 - 1997
  7. 鈕釦花紋之動畫分析,工業局,(86/07~87/06)1997 - 1998
  8. 膠膜式空氣囊靜態壓力分佈模擬與分析,中科院,(90/2~90/11)2001 - 2001
  9. 商用車貨床代木材料研究,慶齡中心,(92/02~93/01)2003 - 2004
專書
  1. 陳榮盛，1992. 6，複材蜂巢蕊編織技術1992
  2. 陳榮盛，1993. 6，耐蝕塗料技術1993
  3. 陳榮盛，1994. 6，汽車保險桿之製程1994
  4. 陳榮盛，1995. 6，汽車保險桿之開發與模擬1995
  5. 陳榮盛，1996. 6，CAE對燈殼射出成型之研發1996
  6. 陳榮盛，1997. 6，以PA/PPE材質成型前葉子板之技術開發1997
  7. 陳榮盛，1998. 6，鈕釦花紋之動畫分析1998
  8. 陳榮盛，2001.11，膠膜式空氣囊靜態壓力分佈模擬與分析2001
  9. 陳榮盛，2004.1.，商用車貨床代木材料研究2004
榮譽事項
  1. 76學年度國科會研究甲種獎1987
  2. 78學年度國科會研究甲種獎1989
  3. 79學年度國科會研究甲種獎1990
  4. 81學年度國科會研究甲種獎1992
  5. 中國土木水利學刊論文獎1993
  6. 82學年度國科會研究甲種獎1993
  7. 83學年度國科會研究甲種獎1994
  8. 中華民國尖端材料會材料科技及製程優勝獎1995
  9. 84學年度國科會研究甲種獎1995
  10. 85學年度國科會研究甲種獎1996
  11. 86學年度國科會研究甲種獎1997

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