Department of Engineering Science, NCKU

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Chuang, Wan-Chun Assistant Professor
Introduction
Chuang, Wan-Chun photo
Name:
Chuang, Wan-Chun
Title:
Assistant Professor
Education:
Ph.D. in Applied Mechanics from National Taiwan University
TEL ext:
63324
Email:
z11302002@ncku.edu.tw
Achievement:
Research NCKU
Laboratory:
Microsystem Design and Analysis Laboratory
Expertise:
Semiconductor and Advanced Packaging Technology, Multi-physics field coupling system analysis, Wafer-level mechanical characterization of thin films, Micro and Nano Systems
Experience
Date
Title
2010-08~2011-07
Full-time Teaching Assistant, Institute of Applied Mechanics, National Taiwan University
2011-10~2012-05
Senior Engineer, Flexible Technology Department, AU Optronics Corporation
2012-08~2020-01
Assistant Professor, Department of Mechanical and Electro-Mechanical Engineering, National Sun Yat-sen University
2016-08~2018-07
Assistant Professor (joint appointment), Department of Sports Medicine, Kaohsiung Medical University
2020-02~2024-01
Associate Professor, Department of Mechanical and Electro-Mechanical Engineering, National Sun Yat-sen University
2024-02~迄今
Assistant Professor, Department of Engineering Science, National Cheng Kung University
Journal
  1. W. C. Chuang*, Y. Huang, and P.-E. Chen, "Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging," Materials, vol. 16, no. 9, 2023.
  2. W. C. Chuang* and W. L. Chen, "Study on the Strip Warpage Issues Encountered in the Flip-chip Process," Materials, vol. 15(1), 323, 2022.
  3. W. C. Chuang* and W. L. Chen, "Investigation of strip warpage behavior in wire bonding process," Journal of Electronic Packaging, vol. 142, pp. 021002-021014, 2020.
  4. W. C. Chuang* and W. L. Chen, "Fatigue prediction for molded wafer level package during temperature cycling," Journal of Electronic Packaging, vol. 142, pp. 011007-011014, 2020.
  5. W. C. Chuang* and W. L. Chen, "Real-time monitoring for knee extensor muscle training with flexible sensors," IEEE/ASME Journal of microelectromechanical systems, vol. 28, pp. 1005-1012, 2019.
  6. W. C. Chuang* and W. L. Chen, "Using Taguchi method to identify the key factors of increasing spacing between the dies during dicing tape expansion," Journal of the Chinese Institute of Engineers, vol. 42, pp. 290-296, 2019.
  7. W. C. Chuang*, "The robustness of an algorithm applied in wafer‑level material property extraction," Microsystem Technologies, vol. 22, pp. 531-536, 2016.
  8. W. C. Chuang*, H. T. Lin, and W. L. Chen, "Strengthening of back muscles using a module of flexible strain sensors," Sensors, vol. 15, pp. 3975-87, 2015.
  9. W. C. Chuang, David T. W. Lin*, Y. C. Hu, H. L. Lee, C. H. Cheng, P. Z. Chang, and N. B. Quyen, "A method integrating optimal algorithm and FEM on CMOS residual stress," Journal of Mechanics, vol. 30, pp. 123-128, 2014.
  10. W. C. Chuang*, Y. C. Hu, and P. Z. Chang, "CMOS-MEMS test-key for extracting wafer-level mechanical properties, " Sensors, vol. 12, pp. 17094-17111, 2012.
  11. W. C. Chuang, C. W. Wang, W. C. Chu, P. Z. Chang, and Y. C. Hu, "The fringe capacitance formula of microstructures," Journal of Micromechanics and Microengineering, vol. 22, pp. 25015-25021, 2012.
  12. W. C. Chuang, H. L. Lee, P. Z. Chang, and Y. C. Hu, "Review on the modeling of electrostatic MEMS," Sensors, vol. 10, pp. 6149-6171, 2010.
  13. W. C. Chuang, Y. C. Hu, C. Y. Lee, W. P. Shih, and P. Z. Chang, "Electromechanical behavior of the curled cantilever beam," Journal of Micro-Nanolithography Mems and Moems, vol. 8, pp. 033020-1 - 033020-8, 2009.
  14. Y. C. Hu, P. Z. Chang, and W. C. Chuang, "An approximate analytical solution to the pull-in voltage of a micro bridge with an elastic boundary," Journal of Micromechanics and Microengineering, vol. 17, pp. 1870-1876, 2007.
Conference paper
  1. 莊婉君*、王中叡，覆晶封裝薄殼結構翹曲模擬模型，中國機械工程學會112年度年會暨第40屆全國學術研討會，彰化，台灣，十二月，2023
  2. 莊婉君*、陳伯恩，不同載台種類對扇出型封裝模化成型製程之晶圓翹曲量影響，2023 中華民國力學學會年會暨第 47 屆全國力學會議，雲林，台灣，十一月
  3. 莊婉君*、陳伯恩，應用人工智能軟體探討模封材料性質變異性對於封裝體翹曲之影響，第一屆台灣計算力學學會年會與第十四屆台灣邊界元素法會議暨學術研討會，基隆，台灣，十月，2023
  4. W. C. Chuang*, P. E. Chen, "The effect of different die size on wafer warpage during decarrier process in fan-out wafer-level packaging." International Conference on Mechatronic, Automobile, and Environment Engineering, Bangkok, Thailand, August 3-5, 2023
  5. W. C. Chuang*, K. L. Hsiao, "Development of a real time motion detection system for assistive seated rowing exercise training." Annual Conference on Engineering and Information Technology, Osaka, Japan, July 12-14, 2023
  6. 莊婉君*、賴彥澄、趙偉祥，不同運動族群之捲腹運動動作分析，台灣機電工程國際學會第八屆全國學術研討會(ISME2023) ，高雄，台灣，四月，2023
  7. 莊婉君*、黃翌、李仁傑，移除載台製程之製程時間對晶圓級扇出型封裝的翹曲影響，台灣機電工程國際學會第八屆全國學術研討會(ISME2023) ，高雄，台灣，四月，2023
  8. 莊婉君*、黃翌，移除載台步驟之製程溫度對晶圓級扇出型封裝的翹曲量影響，台灣機電工程國際學會第八屆全國學術研討會(ISME2023) ，高雄，台灣，四月，2023
  9. 莊婉君*、陳伯恩，模製化合物之玻璃轉換溫度對扇出型封裝移除載台步驟之晶圓翹曲量影響，台灣機電工程國際學會第八屆全國學術研討會(ISME2023) ，高雄，台灣，四月，2023
  10. 莊婉君*、陳伯恩，模製化合物材料特性於楊氏係數對應溫度變化區間對晶圓翹曲量影響，台灣機電工程國際學會第八屆全國學術研討會(ISME2023) ，高雄，台灣，四月，2023
  11. 莊婉君*、王中叡，覆晶封裝薄殼結構模型網格分割技術探討，台灣機電工程國際學會第八屆全國學術研討會(ISME2023) ，高雄，台灣，四月，2023
  12. 莊婉君*、黃翌，模制化合物對扇出型封裝翹曲量影響分析，中國機械工程學會第三十九屆全國學術研討會(CSME39) ，苗栗，台灣，十二月，2022
  13. W. C. Chuang*, Y. Huang, C. Y. Wang, Q. H. Lin, F. S. Chen, Z. W. Chang, P. S. Hsieh, "A model for evaluating warpage of fan-out package during the carrier removal process." International Conference on Mechatronic, Automobile, and Environment Engineering, Penghu, Taiwan, July 15-17, 2022
  14. 莊婉君*、蕭冠倫、賴彥澄、趙偉祥，可撓感測器與接線端子電阻訊號分析，台灣機電工程國際學會第七屆全國學術研討會(ISME2022) ，彰化，台灣，四月，2022
  15. 莊婉君*、賴彥澄、蕭冠倫、趙偉祥，應用於可撓性感測器黏貼之單雙層導電膠帶比較，台灣機電工程國際學會第七屆全國學術研討會(ISME2022) ，彰化，台灣，四月，2022
  16. 莊婉君*、賴彥澄、蕭冠倫、趙偉祥，應用於可撓性感測器黏貼之感測器長度量測比較，台灣機電工程國際學會第七屆全國學術研討會(ISME2022) ，彰化，台灣，四月，2022
  17. 莊婉君*、黃子安 、黃翌 、李仁傑，不同模製化合物在覆晶封裝模製成型製程下翹曲量分析，台灣機電工程國際學會第七屆全國學術研討會(ISME2022) ，彰化，台灣，四月，2022
  18. 莊婉君*、黃翌 、李仁傑，不同模製化合物在覆晶封裝的封膠製程下之應力分析，台灣機電工程國際學會第七屆全國學術研討會(ISME2022) ，彰化，台灣，四月，2022
  19. 莊婉君*、黃翌 、李仁傑，覆晶封裝體在封膠製程中不同模製化合物的應變分析，台灣機電工程國際學會第七屆全國學術研討會(ISME2022) ，彰化，台灣，四月，2022
  20. W. C. Chuang*, K. L. Hsiao, Y. C. Lai, J. C. Li, W. H. Chao, "Motion detection and analysis of 90-degree wrist flexion training," International Conference on Mechatronic, Automobile, and Environment Engineering, Hualien, Taiwan, October 22-24, 2021
  21. 莊婉君*、 賴彥澄 、 蕭冠倫 、 李仁傑 、 趙偉祥 ，腳踏車卷腹訓練動作之偵測與發電系統，第十六屆全國氫能與燃料電池學術研討會暨第八屆台灣能源學會年會(HEFC2021)，台南，台灣，九月，2021
  22. 莊婉君*、蕭冠倫、趙偉祥，手腕屈曲六十度訓練動作偵測與分析 ，台灣機電工程國際學會第六屆全國學術研討會(ISME2021) ，桃園，台灣，五月，2021
  23. 莊婉君*、蕭冠倫、趙偉祥，手腕運動之手部表皮應變探討與分析 ，台灣機電工程國際學會第六屆全國學術研討會(ISME2021)，桃園，台灣，五月，2021
  24. 莊婉君*、賴彥澄、趙偉祥，捲腹運動動作分析與討論，台灣機電工程國際學會第六屆全國學術研討會(ISME2021)，桃園，台灣，五月，2021
  25. 莊婉君*、賴彥澄、趙偉祥，仰臥起坐運動動作分析與討論，台灣機電工程國際學會第六屆全國學術研討會(ISME2021)，桃園，台灣，五月，2021
  26. W. C. Chuang*, Y. C. Chang and Y. C. Lai, "Development of the system for determining the mechanical properties of thin film," International Conference on Mechatronic, Automobile, and Environment Engineering, Kinmen, Taiwan, November 6-8th, 2020
  27. W. C. Chuang*, K. L. Hsiao, W. H. Chao and W. L. Chen, "Development of a real-time motion detection system," International Conference on Mechatronic, Automobile, and Environment Engineering, Kinmen, Taiwan, November 6-8th, 2020
  28. W. C. Chuang*, Y. C. Chan and P. H. Tseng, "Microstructure pull-in voltage extraction system," International Conference on Mechatronic, Automobile, and Environment Engineering, Kinmen , Taiwan, November 6-8th, 2020
  29. 莊婉君*、趙偉祥、陳威龍，手腕運動動作角度偵測系統，中華民國力學學會第四十四屆全國力學會議 (CTAM 2020)，宜蘭，台灣，十一月，2020
  30. 莊婉君*、趙偉祥、張壹筌，微結構吸附電壓萃取系統，中華民國力學學會第四十四屆全國力學會議 (CTAM 2020)，宜蘭，台灣，十一月，2020
  31. 莊婉君*、趙偉祥、陳威龍，隱形雷射後晶圓擴片之模型建立與探討，台灣機電工程國際學會第五屆全國學術研討會(ISME2020)，台中，台灣，八月，2020
  32. 莊婉君*、趙偉祥、張壹筌，萃取薄膜材料之蒲松比系統開發，台灣機電工程國際學會第五屆全國學術研討會(ISME2020)，台中，台灣，八月，2020
  33. W. C. Chuang*, W. L. Chen, "Important factors on the spacing between the dies after sd dicing tape expansion," 22nd International Conference on Materials, Methods and Technologies , Burgas, Bulgaria, June, 22-26th, 2020
  34. W. C. Chuang*, W. L. Chen , C. F. Wang , "Flexible sensor module applied in sit up training exercises," 9th International Conference on Nanotechnology and Materials Science, Osaka, Japan, October, 14-16th, 2019
  35. W. C. Chuang*, W. L. Chen, "Simulation model for single unit warpage of shadow moire in flip-chip process," Conference of Computational Methods in Multi-scale, Multi-uncertainty and Multi-physics Problems, Porto, Portugal, July 15-17th, 2019
  36. 莊婉君*、趙偉祥、陳威龍，潛艦匿聲推進技術評估及市場分析報告，台灣機電工程國際學會第四屆全國學術研討會(ISME2019)，高雄，台灣，二月，2019
  37. W. C. Chuang* and Y. C. Chang, " Empirical formula for estimating frequency of resonator with etched holes," 7th Nanotechnology and Material science, Frankfurt, Germany, November, 5-7th, 2018
  38. W. C. Chuang* and K. Chen, "Analysis of the thermal deformation behavior for a fixed-fixed beam structure," International Conference on Mechatronic, Automobile, and Environment Engineering (ICMAEE), Chiang Mai , Thailand, July 7-9th, 2018
  39. W. C. Chuang* and W. L. Chen, "Simulation model for strip warpage of molding process, " 5th Annual Conference on Engineering and Information Technology (ACEAIT), Kyoto, Japan, March 27-29th, 2018
  40. 莊婉君*、陳楷，微型橋結構之熱變形分析與量測，台灣機電工程國際學會第一屆第三次年會暨全國學術研討會(ISME2018)，台南，台灣，二月，2018
  41. W. C. Chuang* and W. L. Chen, "Development of fabrication for flexible sensor applied to knee flexion and extension training," 33th Sensors and Actuators, Stockholm, Sweden, October 8-11th, 2017
  42. W. C. Chuang*, W. L. Chen, B. Tsai, and J. Su, "Reliability of ball grid array subjected to temperature cycling," Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP’2017), Bordeaux , France, May, 29th - June, 1st, 2017
  43. W. C. Chuang* and K. Chen, "Design of micro torsion-mirror and its electromechanical behavior," International Conference on Mechatronic, Automobile, and Environment Engineering, Yantai, China, May 27th - 29th 2017
  44. W. C. Chuang* and K. Chen, "The key factor of pull-in voltage of micro torsion-mirror structure," International Conference on Mechatronic, Automobile, and Environment Engineering, Yantai, China, May 27th - 29th 2017
  45. W. C. Chuang* and K. Chen, "Empirical formula about pull-in voltage of micro torsion-mirror, " International Conference on Mechatronic, Automobile, and Environment Engineering, Yantai, China, May 27th - 29th 2017
  46. W. C. Chuang* and C. H. Kuo, ""Analysis for electro-mechanical behavior of a fixed-fixed beam with thermal deformation and undercut effect," Asian Conference on Engineering and Natural Sciences, Hokkaido, Japan, January 19th - 21st 2017
  47. W. C. Chuang* and B. Y. Huang, "A real-time monitoring system for Knee Muscles Training," International Conference on Mechanical, Industrial and Power Engineering, Tokyo, Japan, December 6th - 8th 2016
  48. W. C. Chuang*, " Analysis for the variation of resonant frequency of a micro clamped-clamped resonator with etching holes," International Conference on Design and Manufacturing Engineering (ICDME2016), Auckland, New Zealand, November 19-21, 2016
  49. W. C. Chuang* and W. L. Chen, Ben Tsai, Josh Su, "Analysis of wafer level chip scale package subjected to uniform pressure," 2nd International Conference on Computing and Precision Engineering, Kenting, Taiwan, Sep. 30th - Oct. 3th 2016
  50. W. C. Chuang* and J. Y. Lin, "Empirical formula for pull-in voltage of fixed–fixed beam with elastic deformation," 1st International Conference on Engineering and Science, Yilan, Taiwan, July 8-10th 2016
  51. W. C. Chuang*, W. L. Chen, B. Tsai, and R. Wu, " The trends of change of die gap control effect during the process of dicing wafer expanding," Design, Test, Integration& Packaging of MEMS/MOEMS (DTIP’2016), Budapest , Hungary, May, 30th - June, 2nd, 2016
  52. 莊婉君*、黃任廷，具蝕刻孔之微結構電彈性分析及其於可調變共振器之應用研究，中國機械工程學會第三十二屆全國學術研討會(CSME32)，高雄，台灣，十二月，2015
  53. W. C. Chuang* and J. Y. Lin, " Analysis for pull-in voltage variations of fixed–fixed beam with elastic deformation in current input," World Congress on Advances in Structural Engineering and Mechanics(ASEM 2015), Incheon, Korea, Aug. 25-29, 2015
  54. W. C. Chuang*, W. H. Tu, G. S. Lin, J. Y. Hwang, and C. S. Lee, "Fracture mechanism analysis for stealth dicing applied in wafer expansion," Design, Test, Integration& Packaging of MEMS/MOEMS (DTIP'2015), Montpellier, France, April 27-30, 2015
  55. 莊婉君*、戴聿，靜電式驅動之微鏡片扭轉行為研究，中國機械工程學會第三十一屆全國學術研討會(CSME31)，台中，台灣，十二月，2014
  56. W. C. Chuang* , J.Y. Lin, and J.C. Li, “Analysis of pull-in voltage variations in fixed–fixed beams with elastic deformation,” 2nd International Conference of Multi Disciplines of Engineering on Advanced Technology and Environmentalism Design (MDEATED 2014), Tainan, Taiwan, Oct. 31- Nov. 2, 2014
  57. W. C. Chuang*, W. L. Chen, and H. T. Lin, “Optimized design of flexible strain sensor for stimulation of spinal muscles,” 2nd International Conference of Multi Disciplines of Engineering on Advanced Technology and Environmentalism Design (MDEATED 2014), Tainan, Taiwan, Oct. 31- Nov. 2, 2014
  58. W. C. Chuang*, and Y. Dai, “Study on the electro-mechanical behavior of the micro torsion-mirror ,” 2nd International Conference of Multi Disciplines of Engineering on Advanced Technology and Environmentalism Design (MDEATED 2014), Tainan, Taiwan, Oct. 31- Nov. 2, 2014
  59. W. C. Chuang* , W. L. Chen , H. T. Lin, “Flexible strain sensor module applied on the activation of spinal muscle,” 1st International Electronic Conference on Sensors and Application, June 01-16, 2014
  60. W. C. Chuang, and Y. R. Lin, " The robustness of an algorithm applied in wafer-level material property extraction," Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP2014), Cannes, France, April 02-04, 2014
  61. 莊婉君*、林育如，晶圓級薄膜材料性質演算法之穩健性探討，中國機械工程學會第三十屆全國學術研討會(CSME30)，宜蘭，台灣，十二月，2013
  62. 莊婉君*、陳威龍，應用於脊椎肌肉活化訓練之可撓感測器開發，中國機械工程學會第三十屆全國學術研討會(CSME30)，宜蘭，台灣，十二月，2013
  63. 莊婉君*、胡毓忠、林大偉、吳保權、張培仁、李新立、王欽宏，CMOS製程相容之樑結構應力模擬分析技術，中國機械工程學會第二十九屆全國學術研討會(CSME29)，高雄，台灣，十二月，2012
  64. W. C. Chu, W. C. Chuang, W. H. Tu, P. Z. Chang, and Y. C. Hu, "Etching holes effects for CMOS-MEMS capacitive structure," 22nd International Conference on Adaptive Structures and Technologies , paper no:078 ,Corfu –Greece, October 10-12, 2011
  65. W. C. Chuang, Y. C. Hu, C. W. Wang et al., “A Fringing Capacitance Model for Electrostatic Microstructure,” 13th International Congress on Mesomechanics, Vicenza, Italy, 2011
  66. W. C. Chuang, H. L. Lee, T. W. Lin, Y. C. Hu, P. Z. Chang, N. B. Ouyen, “Optimal residual stress in CMOS fabrication,” 34th National Conference on Theoretical and Applied Mechanics, Yunlin, Taiwan, Nov. 19-20, 2010
  67. W. C. Chuang, H. L. Lee, Y. C. Hu et al., “Electromechanical coupling of CMOS-MEMS testkey for extracting material properties,” 1st IFToMM Asian Conference on Mechanism and Machine Science, Taipei, Taiwan, 2010
  68. W. C. Chuang, C. W. Lin, Y. C. Hu et al., “An analytical model for optimizing LCD-cell design,” 12th International Congress on Mesomechanics, Taipei, Taiwan, 2010
NSC Projects
  1. Development of OptoElectroMechanical(OEM) Wafer-Level Testing System for Thin Film Material of CMOS-MEMS Devices (Ⅰ) (NSC 101-2218-E-110 -006)2012 - 2013
  2. Development of OptoElectroMechanical(OEM) Wafer-Level Testing System for Thin Film Material of CMOS-MEMS Devices (Ⅱ) (NSC 102-2221-E-110 -052)2013 - 2014
  3. Electromechanical Characteristics of Microstructure with Etching Holes: Application to Tunable Resonator (MOST 103-2221-E-110 -032)2014 - 2015
  4. Electromechanical Characteristics of A Micro Mirror and its Optimized Design (MOST 104-2221-E-110-011)2015 - 2016
  5. Development and Optimal Design of Testkey for Determining the Thermal Expansion Coefficient of Thin Film (MOST 105-2221-E-110 -036 -MY2)2016 - 2018
  6. Development of A Real-Time Monitoring System of Motion For Exercise Training (MOST 107-2221-E-110-070-MY3)2018 - 2021
  7. Study of Failure Modes For Thin Type Flip Chip Package And Design Optimization (MOST 110-2221-E-110-035)2021 - 2022
  8. Study of Failure Modes For Thin Type Flip Chip Package And Design Optimization (Ⅱ) (MOST 111-2221-E-110-049)2022 - 2023
Industry-university Projects
  1. Yonghua Optoelectronics Co., Ltd.- Laser scribing surface inspection. (N102038)2013 - 2014
  2. Advanced Semiconductor Engineering, Inc. (ASE)- Analysis of fracture mechanisms in wafer dicing using stealth laser technology. (N102114)2013 - 2014
  3. Advanced Semiconductor Engineering, Inc. (ASE)-Dicing wafer expand rule for die to die gap control effect corner chipping. (N103146)2014 - 2015
  4. Advanced Semiconductor Engineering, Inc. -Simulation and analysis for WLCSP protection thickness / material type for package structure. (N104169)2015 - 2016
  5. Advanced Semiconductor Engineering, Inc. (ASE)-Simulation study on dynamic warpage behavior with different substrate thickness and temperature profile. (N105165)2016 - 2017
  6. Advanced Semiconductor Engineering, Inc. (ASE)- Thin wire bond dram product for strip / package warpage influence factor simulation analysis. (N106177)2017 - 2018
  7. Advanced Semiconductor Engineering, Inc. (ASE)- Study on the correlation between die structure and thickness on expanded films and establishment of simulation models. (N107179)2018 - 2019
  8. Advanced Semiconductor Engineering, Inc. (ASE)- Warpage model establishment and optimal design for thin strip structures. (N108215)2019 - 2020
  9. Advanced Semiconductor Engineering, Inc. (ASE)- Study on the application of key properties of compound materials in fan-out packaging processes. (N110232)2021 - 2022
Other
  1. National Sun Yat-sen University and Kaohsiung Medical University Joint Research Program, Top-notch research universities program, development of flexible strain sensor module for spinal muscle activation training. (NSYSUKMU 2013–P033)2013 - 2014
  2. National Sun Yat-sen University and Kaohsiung Medical University Joint Research Program, Top-notch research universities program, development of spinal muscle activation training system. (NSYSUKMU 103-P027)2014 - 2015
  3. National Sun Yat-sen University and Kaohsiung Medical University Joint Research Program, Top-notch research universities program, optimization of flexible sensors for spinal muscle activation training. (NSYSUKMU 104-P029)2015 - 2016
  4. National Chung Shan Institute of Science and Technology-Stealth propulsion technology and evaluation and market analysis. (N107121)2018 - 2019
Patents
  1. FLEXIBLE STRAIN SENSOR AND MEASURING DEVICE WITH SAID FLEXIBLE STRAIN SENSOR2016
  2. MUSCLE TRAINING APPARATUS2017
  3. SYSTEM AND METHOD FOR MEASURING A THERMAL EXPANSION COEFFICIENT2019
Honors
  1. Excellent Course in Electro-Mechanical Materials, 2nd Semester, Academic Year 1012013
  2. Excellent Course in Introduction To Semiconductor Microfabrication Technology, 1st Semester, Academic Year 1022013
  3. 2014"A method Integrating Optimal Algorithm and FEM on CMOS Residual Stress" selected by Advances in Engineering as a Key Scientific Article.2014
  4. 2014-2018: Review Committee Member of Clean Production Technology for Green Factory Label of the Ministry of Economic Affairs, Industry Bureau.2014
  5. "Navigating with Famous Teachers" Course in Introduction To Semiconductor Microfabrication Technology, 1st Semester, Academic Year 103 (for Bachelor's Degree program)2014
  6. 2015-2017 Group leader of Green Energy Group at Engineering and Technology Center.2015
  7. 2015 "Who's Who in the World 32th" collected.2015
  8. 2015"The robustness of an algorithm applied in wafer-level material property extraction" selected by Advances in Engineering as a Key Scientific Article.2015
  9. 2015, Member of Planning Committee for Micro Electro Mechanical Systems (MEMS) and Nanotechnology in the Automation and Control field, Engineering and Technologies Program, Ministry of Science and Technology, Taiwan.2015
  10. Excellent Course in Frontier of Science and Technology, 2nd Semester, Academic Year 1032015
  11. Secretary-General of the Taiwan Association of Mechanical and Electrical Engineering from 2016 to 2018.2016
  12. 2017 Albert Nelson Marquis Lifetime Achievement Award2017
  13. Excellent Course in Frontier of Science and Technology, 2nd Semester, Academic Year 1052017
  14. Excellent Course in Introduction To Semiconductor Microfabrication Technology, 1st Semester, Academic Year 1062017
  15. 2018 "Who's Who in the World" collected.2018
  16. 2018 Albert Nelson Marquis Lifetime Achievement Award.2018
  17. Excellent Course in Frontier of Science and Technology, 2nd Semester, Academic Year 1062018
  18. Excellent Course in Frontier of Science and Technology, 1st Semester, Academic Year 1072018
  19. Excellent Course in Introduction To Semiconductor Microfabrication Technology, 1st Semester, Academic Year 1072018
  20. 2019 Lifetime Achievement Award.2019
  21. 2019 "Who's Who in the World" collected.2019
  22. Member of the Science Popularization Committee of the 37th Annual Meeting of the Chinese Society of Mechanics.2019
  23. 2019 Industry-Academia Collaboration Awards.2019
  24. Excellent Course in Frontier of Science and Technology, 2nd Semester, Academic Year 1072019
  25. Excellent Course in Electro-Mechanical Materials, 2nd Semester, Academic Year 1072019
  26. Excellent Course in Frontier of Science and Technology, 1st Semester, Academic Year 1082019
  27. Excellent Course in Introduction To Semiconductor Microfabrication Technology, 1st Semester, Academic Year 1082019
  28. 2020 "Who's Who in the World" collected.2020
  29. 2020 Forum Speaker on "Semiconductor Process Introduction" at the Southern Taiwan Science Park Administration, Ministry of Science and Technology.2020
  30. Excellent Course in Introduction To Semiconductor Microfabrication Technology, 1st Semester, Academic Year 1092020
  31. Outstanding Teaching Award, Academic Year 1082020
  32. 2021 "Who's Who in the World" collected.2021
  33. 2021-2024 Member of the Women's Development Committee of the Chinese Society of Mechanical Engineering.2021
  34. Outstanding Teaching Award, Academic Year 1092021
  35. Excellent Course in Introduction To Semiconductor Microfabrication Technology, 2nd Semester, Academic Year 110 (EMI Course Reward)2022
  36. Excellent Course in Introduction To Semiconductor Microfabrication Technology, 2nd Semester, Academic Year 111 (EMI Course Reward)2023
  37. 2023 International Society of Mechatronic Engineering Young Mechanical and Electrical Engineering Technology Scholar Award.2023